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| PREPARED BY: hat--/ DATE: /W% SW\ I .-_ -.-.. !r--. *' ,, - SPEC.No. ..- __ .`I ISSUE il . .._ -,@E-* .. _. ,' DG989001 ~ Nov/iOi%l 15 pa& --!' ;.?;: 8. )t3&cMrw APPROVED BY: ry/Bty"/"y; 7 z2GJGil`cI `$f ELECTRONIC COMPONENTS GROUP SHARP CORPORATION REkESE~i%T=WEJX@IO+ Opto-Electronic DevicesDivision SPECIFICATION DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. LT 1ZR95A series 1. Thesespecification sheets includematerialsprotectedunderthe copyright of SharpCorporation("Sharp"). Please not reproduce cause do or anyoneto reproducethem without Sharp's consent. 2. When usingthis product, please observethe absolutemaximumratingsandthe instructionsfor useoutlined in thesespecificationsheets, well asthe precautions as mentioned below.Sharpassumes responsibility no for any damage resultingfrom useof the product which doesnot complywith the absolute maximumratings andthe instructionsincludedin thesespecificationsheets, the precautions and mentionedbelow. (Precautions) (1) This productsis designed usein the following applicationareas; for * OA equipment * Audio visual equipment * Homeappliance * Telecommunication equipment(Terminal) * Measuringequipment r * Tooling machines * Computers I If the useof the productin the above applicationareas for equipment is listed in paragraphs (2) or (3), please sureto observethe precautions be given in thoserespectiveparagraphs. (2) Appropriate measures, asfail-safe designand redundant such design considering the safety design the overall systemand equipment,should takento ensurereliability of be and safetywhenthis product is usedfor equipmentwhich demands reliability and high safety in function andprecision,such as; * Transportation control andsafety equipment(aircraft, train, automobile etc.) * Traffic signals * Gasleakagesensor breakers * Rescue security equipment and I L * Other safetyequipment (3) Please not usethis product for equipmentwhich requireextremelyhigh reliability do and safety in function and precision,suchas ; * Spaceequipment * Teleconmumication equipment trunk lines) (for * Nuclearpower control equipment * Medical equipment I (4) Please contact andconsultwith a Sharpsales representative thereare any questions if regardinginterpretationof the above threeparagraphs. 3. Please contact andconsultwith a Sharpsales representativefor anyquestions about this product. DATE: Jl/av /4/ PRESENTEDBY: , 4m M.Katoh, Department GeneralManagerof Engineering Dept.,111 Opto-ElectronicDevicesDivision ElectronicComponents Group SHARPCORPORATION 1 /PPl? CUSTOMERS APPROVAL DATE: BY: DG98900 1 .' LTlZIWA series Nov/10/98 PAGE I' ----Q5 : -' -; "73 - e-3 ;-.. .. ..,i-II . .-..- -.__*_ -3 -------.2 LTlZR95A series Snecification 1. Application This specification applies to the light emitting diode device Model No. LTlZR95A (AlGaInP chip LED device) series. 2. Outline dimensions andterminalconnections .**..*.-...-.-...*--.' Refer to the attached sheet Page 2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..RefertotheattachedsheetPage3. 3- 1. Absolute maximum ratings 3-2. Electra characteristics 3-3. Optical characteristics 3-4. Luminous intensity rank 4.CharacteristicsDiagrams .-..-..-.....-.-......-.....--.....-... Refer to the attached sheet Page 4-7. 5. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..Referto~eafiachedsheetpage8. 5- 1. Test items and test conditions 5-2. Failure judgement criteria 6. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..Refertotheattachedsheetpage9. 6- 1. Inspection method 6-2. Description of inspection and criteria 7. Taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet 7- 1. Taping 7-2. Label 7-3. Dampproof package 8. Soldering . . . . ..*.............................................. Refer to the attached sheet 8- 1. Reflow soldering 8-2. Manual soldering 8-3. Dip soldering method 9. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet 9- 1. Precautions matters for designing circuit 9-2. Cleaning method 10. Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet lo- 1. Ozonosphere destructive chemicals. 10-2. Bromic non-burning materials Page 10-13. Page 14. Page 15. Page 15. ------..~~8900 1 1 NodlO/ . 2. Outline dimensions and terminal connections mark p Q) . 7 I 0. . , \\ \ -L-------- -----L--- 0 Anode / @ Cathode / i ote. . It is not include the flash in this dimension. !. Pin Connection @ Anode @ Cathode ;. Unspecified tolerance to be rfr0.2 unit mm Scale Free I Applicable Model LTlZR95A series Drawing No. 51009001 3. Ratings and characteristics (Notel) Duty ratio=l/lO,Puke width=O. lms (Note2) Manual soldering Max.3second 3-2. Electra characteristics Parameter Forward voltage Reverse current Terminal Symbol VF IR Conditions 1$=2oRL4 VR4V MIN. TYP. (2.2) MAX. 2.6 100 - (Ta-25C) unit V PA PF capacitance Ct v=ov,+1MHz - 60 luminous intensity rank 1 LTlZR95A 1 (Note3)Measured 1G 1H 1 I j bbiFlGt by SHARP EGQG MODEL550(Radiometer/Photometersystem) 200 J 1 623 644 I 618 635 3-4.Luminousintensity rank Rank : Luminousintensity IRank : Luminousintensity b _ a A B c D : : : : : : 4.8 6.9 10 14 21 30 9.2 13.2 19 28 40 58 / ' 1 / / E F G H I J : : 43 62 84 121 174 250 360 518 (Ta=25'C) unit Condition : 89 : 128 : 185 : 266 mcd Ie2OmA Tolerance:+15% I _I 4 Characteristics Diagrams LTlZG95A Relative Luminous Intensity vs. Forward Current (Ta=25%) 1000 1 LTlZE95A Nov/10/98 Relative Luminous Intensity vs. Forward Current (Ta=25%) ; s .E 3 P .0 Ti oi 0.1 1 10 loo 9 & I x ..$ 8 E loo 10 1 0.1 1 10 100 Forward Current IdmA) Forward Current vs. Forward Voltage (~~25% Forward Current I,(mA) Forward Current vs. Forward Voltage (~~~25% 1.7 2.2 Forward Voltage V,(V) Relative Luminous Intensity vs. Ambient Temprature 1.2 1.7 2. 2 Forward Voltage VA(v) Relative Luminous Intensity vs. Ambient Temorature 2.7 I 1 I / ! I I -60 -40 -20 0 20 40 60 80 100 120 Ambient Temperature ("c) rte)Above characteristic -60 -40 -20 0 20 40 60 80 Ambient Temperature ("C) 100 120 data are typical data and not a gtuanted data. ZGIZE PAGE 4 Characteristics Diagrams LTlZV95A LTlZS95A Relative Luminous Intensity vs. Forward Current Relative Luminous Intensity vs. Forward Current 1000 I j/ 1 0.1 10 1 Forward Current Ir(rnA) Forward Current vs. Forward Voltage (Ta=25Q loo 0.1 1 10 Forward Current IdmA) Forward Current vs. Forward Voltage (T&S% loo 100 t i i i / i Vi I j j i / i / / I I I i i i 1i 1.1 2.2 Forward Voltage V,(V) Relative Luminous Intensity vs Ambient Temprature loo0 1.7 2.2 Forward Voltage Vr(V) Relative Luminous Intensity vs. Ambient Temprature I z .3 2 10 -60 -40 -20 0 20 40 60 80 100 120 Ambient Temperature ("C) / I I I j I / I -60 -40 -20 0 20 40 60 80 100 120 Ambient Temperature ("c) ;Note)Above characteristic data are typical data and not a guranted data. I F-> i: DG98900 1 -Mt3DEb~o... .?I I,, * 1.: .:`:------- I ------ NodlO/ ___. PAGE . -.. . LTlZR95A set& .., 3 ;-"x 4 Characteristics Diagrams LTlZJ95A LTlZR95A Relative Luminous Intensity vs. Forward Current (Ta=25"C) Relative Luminous Intensity vs. Forward Current (Ta=25%) 1000 0.1 Forward Current I&A) Forward Current vs. Forward Voltage 100 loo (~~~25% 1 10 loo Forward Current I,(mA) Forward Current vs. Forward Voltage (Ta=25"C \ LL 0.1 1.7 2.2 Forward Voltage Vr(V) Relative Luminous Intensity vs. Ambient Temprature 1000 `;; r x .z 2 E .2 100 s .E 3 z .3 d" 10 -60 -40 -20 1000 Ii / I i 2. 7 1.2 1.7 2.2 Forward Voltage Vr(V) Relative Luminous Intensity vs. Ambient Temprature 2. 7 0 20 40 60 80 100120 -60 -40 -20 Ambient Temperature ("c) 0 20 40 60 80 100 120 Ambient Temperature ("C) Se)Above characteristic data are typical data and not a gurattted data. ZJIZR I Characteristics Diagrams LTlZR95A series Peak Forward Current Derating Curve 120 100 80 60 40 20 0 -25 0 25 50 75 loo 125 Ambitent Temprature Ta("C) Forward Current Derating Curve 60 -25 0 25 50 75 100 Ambitent Temprature Ta("C) Peak Forward Current vs Duty Ratio(Ta=2S'C) 125 125 Duty Ratio DR )te)Above characteristic data are typical data and not a guranted data, 5. Reliability The reliability of products shall be satisfied with items listed below. 5-1. Test items and test conditions(in accordance with JIS 7021) Test items temperature cycling High temp. and high humidity storage High temperature storage Test conditions -55"c(30min)--+110"c(30min),100cy Ta=+85"C, 85%RH, t=lOOOh Ta=(Tstg-maximum ratings),tzlOOOh Confidence level: 90s LTPD Samples (n) Defective (C) (%) n=22, C=O n=22, C=O n=22, C=O n=22, C=O n=22, C=O n=ll, C=O 10 10 10 10 li, 20 20 Low temperature storage Ta=(Tstg_minimun ratings),t=lOOOh Operating test Mechanical shock Variable frequency vibration Solderingheat Ta=25cC,Ir=(Ir~maximum ratings),t=lOOOh 15 OOOm/s', 0.5ms, 3times I *X,+Y,*Z direction 200mis2, 100-2 OOO-IOOHu'sweepfor 2Omin., 4timeslX,Y,Z direction Refer to the attachedsheet, Page141151 time n=ll, C=O n=l 1, C=O 20 5-2. Failurejudgementcriteria (Notel) Parameter Forward voltage Reversecurrent Luminousintensity Symbol VF IR Failurejudgementcriteria (Note2) v, > U.S.L. x 1.2 IR > U.S.L. x 2.0 Iv Iv > The first stagevalueX 2.0 or The first stagevalue X 0.5 > Iv (Note 1)Measuring condition is in accordance with specification. (Note2)U.S.L. is shownby UpperSpecificationLimit. Nov/lOi98 ; .: MODELN& d i -i1,3 `--.-. - __ PAGE L~l2~95~seiies 6. Incoming inspection 6- 1. Inspection method A single sampling plan, normal inspection level II based on IS0 2859-l shall be adopted. 6-2. Describtion of insnection and criteria \lO. Inspection items Electra-optical characteristics Radiation color Taping Tape peeling Label Mix Quantity wanting Luminous intensity Electra-optical characteristics Outline dimensions Label Dust and flaw Criteria Not radiation Not correct Product inserted in reverse direction Continuous separation of cover tape causing the product to fall out Model number is not printed,or misprinted Another model is mixing Quantity in package is wanting Not conforming to the specification Not conforming to the specification Not conforming to the specification Quantity or Lot No. is misprinted Effect to the specification Defect AQL I 2 3 4 5 6 7 8 9 0 1 2 3 Major defect 0.1% Minor defect 0.4% Resin flash 0.3mm or greater from the product .. ^. .. . .. *. . . `1 Juogement area : I he platedareaot me product bottom and side 7. Taping 7-l Taping 7- 1- 1.Shape and dimension of tape(TYP.) --------------_ rl % Material : Carrier tape...PS, Cover tape.. . Polyester 7-l-2.Shape and dimension of reel(TYP.) I Parameter IDiameter Frange Thickness Inner space direction External diameter Hub Spindle hole dimWidth 1Symbol 1 Dimension 1 Remarks I I bm(=p.) A t b 178 -1.5 W R I I i I lfl nimnnckn 4 f i.0 I -f DG98900 1 ,$--MMoDti -No. .-. -J LTI'ZR95A s&ii :. - NovIlOl98 PAGE ~---1211_5 7-I-3.Taping specification (1) Lead tape: End Pull out [ > Bigining Empty 10 pith or more ' Stuffed Empty 10 pith or more Leading (2) Cover tape strength against peeling:F=O. I-0.8N( Cover tape 0 =Wor less) F uuuuuuuuuuuu~ Carrier tape 0 - lo" Tape speed : 5mm/s (3) Tape strength against bending: The radius of bending circle should be 3Omm or more. If it is less than 3Omm, the cover may peel. There should not be joint of cover tape or carrier tape. (4) Jointing of tape: Average 2,OOOpcs. per reel (5) Quantity per reel: Approx. 0.03 g (6) Product weight: 0 Apparent defect of product should not be packed and product should not upset. (7) Others: @ There should not be missing above continuous three products. 0 Products should be easily taken out. @ Products should not be attached to the cover tape at peeling. 7-2. Label for reel SHARP CORPORATION PART No. LTlZR95A + Model number , r g$C);;F'y + EIAJ C-3 barcode + Luminous rank and dominant wavelength rank + Production country Q'i^"" 1-1 Lot number *- ~000 LOT No. KA98HOl RANK AA JAPAN t :Lot number indication cl00 G0 ~c?c2@0 C' 77 cg, L&j 0 Production plant code(to be indicated alphabetically) @ Production lot(single or double figures) @ Year of production(the last two figures of the year) @ Month of production (to be indicated alphabetically with January corresponding to A) 0 Dateofproduction(Ol-31) 7-3. Dampproof package In other to avoid the absorption of humidity in transport and storage, the devices are packed in aluminum sleeve. Label *+ o&f& 6 Silicagel Q Ree1 Label 7-3-l.Strage conditions Temperature : 5 to 30% Humidity : less than 6O%RH 7-3-2.Treatment after opening (1) Please make a soldering within 2 days after opening under following condition; Temperature : 5 to 30C Humidity : less than 6O%RH (2) In case the devices are not used for a long time after opening ,the storage in dry box is recommendable. Or it is better to repack the devices with a desicative by the sealer and put them in the some storage conditions as 7-3- 1. Then they should be used within 2 days. (3) Please make a soldering after a following baking treatment if unused term should be over the conditions of(2) Recommendable conditions: Q in taping Temprature:60"C to 65"C,Time:36 to 48 hours @ in individual (on PWB or metallic tray) Temprature: 100C ,Time:2 to 3 hours Nov/10/98 8. Soldering 8- 1.Retlow soldering (1) It is not recommended to exceed the soldering temperature and time shown below. Caused by substrate bend or the other mechanical stress during reflow soldering may happen gold wire disconnection etc. Therefore please check and study your solder reflow machine's best condition. (2) Reflow soldering temperature protile to be done under the following condition. to be done under the following condition. MAX 250 Time Ls) Recommendable Thermal Model (4) Recommendable Metal Mask pattern for screen print Recommend 0.2mm to 0.3mm thickness metal mask for screen print. Caused by solder reflow condition, solder paste, substrate and the other material etc., may change solderbility. Please check and study actual solderbility before usage. r Center VI ei 1 of the product Recommended solder pattern 8-2.Manual soldering (1) It is recommended to keep the soldering iron temperature at 295C (soldering iron power consumption 20W) and not to solder more than once or for over 3 seconds. (2) When using a soldering iron, care must be taken not to damage the package. (Pay attention not to allow any under stress or heat on package.) 8-3. Dip soldering method To be done under the following condition. Pre-heat temp. : 80 to 120 "C time : 30 to 120 seconds Soldering temp. : Max. 260% time : within 5 seconds 9. Precautions for use 9-1. Precautions matters for designing circuit This product is not designed as electromagnetic and ionized-particle radiation resistant. 9-2. Cleaning method (1) Solvent cleaning @ Solvent temperature is not more than 45 "C. @I Immersion up to 3 minutes. Recommend conditions: (2) Ultrasonic cleaning The affect on the device from ubrasonic bath, ultrasonic output, duration, board size and device mounting method. Test the cleaning method under actual conditions and check for abnormalities before actual use. (3) Solvents Use only the following types of solvent. water, alcohol, chlorofluorocabon-based solvent when cleaning is necessary. Recommend conditions: RT. 4OKHz,3OW/l, 3 to 5 minutes IO. Environment lo- 1. Ozonosphere destructive chemicals. (1) The device doesn't contain following substance. (2) The device doesn't have a production line whose process requires following substance. Restricted part: CFCs,halones,CC&,Trichloroethane(Methychloroform) 10-2. Bromic non-burning materials The device doesn't contain bromic non-burning materials(PBBOs,PBBs) |
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